X-RAY

X-RAY Test (X-RAY)

X-ray testing uses X-ray penetration to detect the internal structure of ICs and lead imaging effects, which is a non-destructive test. It mainly uses X-ray irradiation imaging to check the hardware components inside the device, mainly checking the pin frame of the chip, wafer size, gold wire binding diagram, ESD holes and damage, and other information. Customers can provide gold samples (good products) for comparative testing according to actual needs.

     Scope of application of X-ray inspection:

1. Auxiliary IC authenticity verification.
2. Analysis of the causes of failure of auxiliary ICs or devices
1. Defect inspection in IC packaging (layer peeling, bursting, voiding, and wire integrity inspection)
2. Defects that may arise in the printed circuit board process (misalignment or bridging and open circuit)
3. SMT solder joint void detection and measurement
4. Defect inspection of open circuits, short circuits or abnormal connections that may occur in various connection lines
5. Integrity inspection of solder balls in solder ball array packaging and chip clad packaging
6. Cracked or cavity inspection of high-density plastic materials
7. Chip size measurement, line arc measurement, and tin area ratio measurement on the device.
3. Thick metal sheets on the surface cannot be detected.