Decapsulation

Decapsulation

The lid opening test (unsealing) is mainly to use relevant instruments and equipment to cut and corrode the surface package of the IC, combined with a metallographic microscope to observe whether there is a wafer inside the IC, whether the structure, size, inscription, and logo of the wafer are consistent with the original sample, and whether there is an EOS/ESD breakdown phenomenon.

This test is usually used for chip authenticity verification and chip failure cause analysis

Note: The lid opening test (DECAP) is a destructive experiment, usually using laser etching and chemical reagent corrosion methods to remove the package shell outside the component, so as to better observe the structure, size, words, logos and other information of the wafer inside the device, and assist in chip authenticity verification and analysis of the cause of chip failure.